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TZID:Australia/Brisbane
X-LIC-LOCATION:Australia/Brisbane
BEGIN:STANDARD
DTSTART:19920301T030000
TZOFFSETFROM:+1100
TZOFFSETTO:+1000
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BEGIN:VEVENT
DTSTAMP:20191203T080637Z
LOCATION:Great Hall 1&2
DTSTART;TZID=Australia/Brisbane:20191117T185100
DTEND;TZID=Australia/Brisbane:20191117T185200
UID:siggraphasia_SIGGRAPH Asia 2019_sess222_papers_273@linklings.com
SUMMARY:A Thermomechanical Material Point Method for Baking and Cooking
DESCRIPTION:Technical Papers Fast-Forward \n\nA Thermomechanical Material 
 Point Method for Baking and Cooking\n\nDing, Han, Wang, Gast, Teran\n\nWe 
 present a Material Point Method for visual simulation of baking breads, co
 okies, pancakes and similar materials that consist of dough or batter mixt
 ures of mainly water, flour, eggs, fat, sugar and leavening agents. We dev
 elop a novel thermomechanical model using mixture theory to resolve intera
 ctions between individual water, gas and dough species. Heat transfer with
  thermal expansion is used to model thermal variations in material propert
 ies. Water based mass transfer is resolved through the porous mixture, gas
  represents carbon dioxide produced by leavening agents in the baking proc
 ess and dough is modeled as a viscoelastoplastic solid to represent its va
 ried and complex rheological properties. Water content in the mixture redu
 ces during the baking process according to Fick's Law which contributes to
  drying and cracking of crust at the material boundary. Carbon dioxide gas
  produces by leavening agents during baking creates internal pressure that
  causes rising. The viscoelastoplastic model for the dough is temperature 
 dependent and is used to model melting and solidification. We discretize t
 he governing equations using a novel Material Point Method designed to tra
 ck the solid phase of the mixture.\n\nRegistration Category: Platinum Pass
 , Full Conference Pass, Full Conference One-Day Pass, Basic Conference Pas
 s, Student One-Day Pass, Exhibitor Pass
URL:https://sa2019.conference-program.com/presentation?id=papers_273&sess=
 sess222
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